Product Description:
A High Density Interconnect (HDI) PCB is a type of multilayer interconnect printed circuit board that offers high performance and reliability for various electronic applications. The HDI PCB product we offer is designed to meet the demanding requirements of modern electronic devices, providing advanced features and capabilities.
One of the key attributes of our HDI PCB product is the minimum line space of 0.075mm, which allows for intricate and compact circuit designs with high signal integrity. This feature enables the HDI PCB to accommodate a large number of components in a small area, making it ideal for applications where space is limited.
The use of high-quality base materials such as FR4, ROGERS, Aluminum, High Tg ensures the reliability and performance of the PCB in different operating conditions.
Impedance control is a critical aspect of high-speed circuit designs, and our HDI PCB product offers ±10% impedance control to ensure signal integrity and minimize signal distortion. This level of impedance control is essential for applications that require high data transmission rates and reliable signal processing.
Furthermore, our HDI PCB product features a copper thickness of 1OZ, which enhances the conductivity and thermal performance of the circuit board. The use of high-quality copper helps to improve the overall reliability and efficiency of the PCB, making it suitable for a wide range of electronic applications.
In summary, our High Density Interconnect (HDI) PCB product is a high-performance printed circuit board that offers advanced features, which is used for electronic applications that require high reliability, performance, and efficiency.
Technical Parameters:
| Board type |
FR4 TG170 1.6MM |
| line width/space |
3/3mil |
| Cu Thickness |
1OZ |
| Surface finish |
Immersion Gold |
| Impedance Control |
±10% |
| Type Of Assembly |
SMT And Thru-hole |
| Special technology |
BGA, Resin plugging + plated over |
| Service Type |
PCB Prototype/ Mass production |
